Advantages
High temperature resistance
Excellent dimensional stability
High strength and accuracy
Ideal Applications
Prototypes need high-temp resistance
Quick mold
Technical Data-sheet
| Liquid Properties |
Optical Properties |
| Appearance |
Semi-translucent |
Dp |
13.5 mJ/cm2 |
[critical exposure] |
| Viscosity |
340 cps@30℃ |
Ec |
0.115 mm |
[slope of cure-depth vs. In (E) curve] |
| Density |
1.14 g/cm3 |
Building layer thickness |
0.08-0.12 mm |
|
| Mechanical properties |
UV post curing |
| Test items |
Test Methods |
Numerical value |
Test Methods |
Numerical value |
| Tensile Strength |
ASTMD 638 |
65MPa |
GB/T1040.1-2006 |
71MPa |
| Elongation at break |
ASTMD 638 |
3-5% |
GB/T1040.1-2006 |
3-5% |
| Bending strength |
ASTMD 790 |
110MPa |
GB/ T9341-2008 |
115MPa |
| Flexural modulus |
ASTMD 790 |
2720MPa |
GB/ T9341-2008 |
2850MPa |
| Izod notched impact strength |
ASTMD 256 |
20J/m |
GB/T1843-2008 |
25J/m |
| Shore hardness |
ASTMD 2240 |
87D |
GB/T2411-2008 |
87D |
| Glass transition temperature |
DMA, tan θ peak |
135℃ |
|
|
| Thermal expansion coefficient(25-50℃) |
ASTME831-05 |
50 µ m/m℃ |
GB/T1036-89 |
50 µ m/m℃ |
| Thermal expansion coefficient(50-100℃) |
ASTME831-05 |
150 µ m/m℃ |
GB/T1036-89 |
160 µ m/m℃ |
Recommended temperature for processing and storage of the above resin should be 18℃-25℃.
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